Braid extraction of excess solder. Length: 1.5 m Width: 1.5 mm
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- Item Code: I85104581015
- Help Code: DM-0031-1.5
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Item Description
Removes brazing from solder joints by bonding
Made of weave, free from oil and oxide contamination of copper wire of very small diameter
Covered with a thin layer of rosin which improves adhesion properties and protects the braid from undesired oxidation
Ensures removal of solder eliminating the danger of overheating of the desolder
The braid is suitable for work with both the CMOS and SMD elements
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